Call for Participation
Technical Conference and Professional Development Courses on
Design, Printed Circuit Boards, Electronics Assembly and Test
March 29 – April 2, 2009
Las Vegas, Nevada
Submit an abstract for the industry’s premier conference on electronics manufacturing in Las Vegas. IPC APEX EXPO — developed and presented by the industry for the industry — provides significant visibility for you and your company on your research and knowledge. Thousands of individuals will receive the technical proceedings, ensuring that your published paper is seen by key engineers, managers and executives from all segments of the electronic interconnection industry worldwide. Our new venue in Las Vegas promises to raise your global exposure due to the worldwide appeal of this world-class destination.
Conference and Course Topics:
Submissions are sought on design, materials, assembly, processes, and equipment in the following areas or other related areas:
- Advanced Technology
- Area Array/Flip Chip/0201
- Assembly Processes
- BGA Packaging
- Black Pad
- Business & Supply Chain Issues
- Design
- Electromigration & Tin Whiskers
- Electronic Manufacturing Services
- Embedded Passive & Active Devices
- Environmental Compliance
- Factory Automation
- Flexible Circuitry
- HDI Technologies
- High Speed, High Frequency & Signal Integrity
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- Lead-Free Fabrication & Assembly
- Microminiaturization
- Optoelectronics
- Packaging & Components
- PCB Fabrication
- PCB Storage & Handling
- Performance, Quality & Reliability
- Printed Electronics
- Rework & Repair
- RFID Circuitry
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Via Plugging & Other Protection
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Technical Conference Requirements for Submission
Provide an abstract of approximately 300 words that summarizes technical and previously unpublished, noncommercial work covering case histories, research and discoveries. It must be received by July 18, 2008.
Although the abstract deadline of July 18, 2008, has passed, IPC’s Technical Program Committee will consider additional submissions if appropriate. For more information about conference participation, contact Greg Munie, Conference Director, at Greg@Munie.org or Toya Richardson at +1 847-597-2825.
The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to assess content of the proposed paper. If selected, papers will be due December 12, 2008, and should be a minimum of six pages in length (text and graphics). The paper should be noncommercial in nature and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Oral presentations will be limited to 30 minutes including 5 minutes for attendee questions.
Conference Benefits
Conference speakers are entitled to a copy of the Proceedings, a free One-Day Conference Pass for the day of your presentation, discounted registration fees for the full conference, and complimentary admission to the Exhibit Hall. All speakers selected for presentation who provide their papers to IPC by Wednesday, November 14, will be eligible for a free full-conference pass.
Conference Awards
To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and the “Best International Paper” for non-U.S. authors. Each award is $1,000 with a recognition plaque. Co-authors share the cash award and each receives a recognition plaque.
Please Note
Previously published papers and papers focused on a company or its products are not appropriate and will not be accepted.
Professional Development Courses
Proposals are also solicited from individuals interested in teaching full-day (six hours) or half-day (three hours) professional development courses on design, printed circuit board and electronic manufacturing processes and materials to a class of up to 50 persons. Proposals, including course descriptions, must be submitted by July 18, 2008.
Although the course proposal deadline of July 18, 2008, has passed, the course review committee will consider additional submissions if appropriate. Please contact Michelle Michelotti, IPC professional development coordinator, at +1 847-597-2822, to discuss your submission.
A master copy of the course workbook must be submitted by January 16, 2009. An honorarium is offered to professional development instructors. Contact IPC at +1 847-597-2877 for more information and to find out how you can earn a FREE conference pass.
Abstract and Proposal Instructions
| Conference Paper Timeline |
Professional Development Timeline |
| Abstracts Due: July 18, 2008 |
Proposals Due: July 18, 2008 |
| Acceptance by: August 29, 2008 |
Acceptance by: August 29, 2008 |
| Papers Due: December 12, 2008 |
Workbooks Due: January 16, 2009 |
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