Technical Conference

Tuesday–Thursday, April 1–3

This technical conference is known worldwide as one of the finest and most selective in the world. Take advantage of new research and innovations from key industry players in the areas of board design and manufacture, and electronics assembly. New sessions this year include a focus on manufacturing software, backwards compatibility, and 3-D packaging. That’s in addition to our annual focus on key areas like soldering, assembly processes, advanced packaging, materials and reliability.

Sign up for one day, the full conference or get the most for your money with the Maximum Value Package. Find the package to suit your needs here (.pdf). Sign up by March 4 and save 20%. Download the hard copy brochure here (.pdf)

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