Free Forums give you even more reasons to attend! Join industry experts and peers as they discuss cutting-edge challenges and solutions in these interactive sessions. Get the latest on vexing industry issues at these FREE sessions.
Tuesday, April 1 |
F01: iNEMI Lead Free Review
Tuesday, April 1, 1:30 pm–3:00 pm
Chair: Robert Pfahl, iNEMI
The electronics industry prepared to go lead free for a number of years, but the transition to optimized lead-free manufacturing is just beginning. Much work remains to optimize the conversion from eutectic solder and to achieve the same knowledge we have with tin-lead processes. This free forum will provide results of iNEMI’s lead-free projects on wave soldering and mixed soldering. In addition, iNEMI’s projects in rework and surface finishes will be reviewed. |
F02: Lead-Free Reliability — Where Are We Now?
Tuesday, April 1, 3:15 pm–4:45 pm
Chair: Jack Fisher, Interconnect Technology Analysis, Inc.
This session is a continuation of IPC’s focus on reliability needs for the future. In the IPC 2005–2006 International Roadmap for Electronic Interconnections, reliability testing protocols were discussed and updated. In 2007, a Reliability Summit was held. The feedback from the Summit initiated a reliability survey that many engineers and managers completed in 2007. The results of the survey will be presented, along with information on reliability activities from IPC, industry consortia and academia. |
Wednesday, April 2 |
F03: Safety in the Electronics Industry
Wednesday, April 2 8:30 am–10:00 am
Co-chairs: Beverley Christian, Ph.D., Research In Motion, Ltd. And Lee Wilmot, TTM Technologies, Inc.
Should you make your assemblies lead free or not? Which board finishes are best for the intended application? What solder paste should be used for highest product reliability? All good questions, but do you ever think about the safety of you and your fellow workers in the actual plant making the product? What accident rates does our industry have? What kinds of accidents are most prevalent? As much as we’d hate to think that injury or death can touch us or someone we know, accidents do happen. Be proactive when it comes to safety. Attend this free forum for an instructive session on safety in the assembly workplace. |
F04: Material Pre-Selection Through a New Database for PCBs at UL
Wednesday, April 2 10:15 am–11:45 am
Chair: Barry Kalian, Underwriters Laboratories Inc.
Other Participant: Crystal Vanderpan, Underwriters Laboratories Inc.
Discover the benefits of material pre-selection. The selection of components, subassemblies and individual materials such as PCBs and laminates is a key function in the design of electrical products. Pre-selection is a valuable tool that helps product designers find materials that comply with safety standards. It also greatly reduces the time and cost associated with final end-product testing, thereby speeding time to market. With the launch of UL’s new “iQ Database” for PCBs (first quarter of 2008), parametric searches using critical pre-selection criteria will be feasible. Join this forum for an enlightening discussion on the benefits of material pre-selection and the new UL database that makes it all possible. |
F05: Counterfeit/Trusted “How Do I Know It’s the Real McCoy?”
Wednesday, April 2 1:30 pm–3:30 pm
Chair: Denny Fritz, MacDermid, Inc.
Other Participant: Ron Thompson, SAIC
While your company may never have been burned by counterfeit electronics, how can you prevent this “straight from the headlines” practice? How extensive is the problem, especially at the board assembly and board fabrication levels? Even if you are a supplier, how can you protect your brand name and prevent false accusations, service calls, and litigation? Learn how extensive this problem is and how you can protect both yourself and your organization. |
Thursday, April 3 |
F06: Best Practices for Exempt Manufacturers in a Lead-Free World
Thursday, April 3 8:30 am–10:00 am
Chair: R. Wayne Johnson, Auburn University
RoHS and other lead-free legislation exclude certain high reliability applications such as high-end servers, military, aerospace, space, medical and automotive from restrictions on the use of lead. However, manufacturers in these industries are feeling the impact of the move to lead-free electronics by the overwhelming majority of the electronics industry. Availability of tin-lead terminated parts, part numbers not changing to reflect changes in surface finish or solder ball alloy, and tin finishes are just a few of the issues being faced. This session will begin by examining the best practices within these industries as they try to continue tin-lead assembly in a lead-free world. The session will also address the specific long term reliability data required to transition to lead-free assembly in these applications. |
F07: Test And Inspection Summit
Thursday, April 3 10:15 am–11:45 am
Chair: Rick Nelson, Test & Measurement World
Other Participants: Jack Rozwat, general manager, Agilent’s Americas Electronics Measurement Test Field Operations; Glenn Woppman, president and CEO, Asset Intertech; Dr. Steve Case, chairman and founder, CyberOptics Corporation; John VanNewkirk, CEO, CheckSum; Chad Hankinson, President - Fixture Services Group, Everett Charles Technologies; Don Miller, president, YesTech, Inc.
Sponsored by: Test & Measurement World
As board complexity increases and component dimensions decrease, test engineers are finding it increasingly challenging to develop test strategies that maximize quality while keeping test costs under control. Rarely will one test or inspection technology suffice to deliver defect-free boards. Engineers must determine the optimum mix and match of these technologies: in-circuit electrical test, optical inspection, X-ray inspection, functional electrical test and JTAG/boundary-scan test. Furthermore, engineers must evaluate tradeoffs within these broad technology areas. Benefit from a panel of industry experts who will provide their recommendations and participate in an interactive discussion. |
Novel Modified Epoxy Adhesive for FCCL for High Thermal Resistance
Huazhi Wang, Juijiang Flex Co., Ltd. |
Overcoming the Challenges of Achieving Improved Dielectric Properties in Fiberglass
Anthony V. Longobardo, Ph.D., AGY World Headquarters |
Electrostatic Discharge (ESD), the Technology Roadmap of the Semiconductor Industries to 2015 and the Development of PCBs
Hartmut Berndt, B.E.STAT European ESD Competence Centre |
Bromine Science & Environmental Forum
Susan Landry, Albemarle Corporation |
Mixed Alloy Soldering Process Application for Ball Grid Array (BGA) Package
Xin Yong Yu and Jane Feng, Flextronics |
Halogen Free FR Systems for Advanced Printed Circuit Boards
Nikolas Kaprinidis, Ciba Corporation |
Ball Attachment Assessment of Re-Balled Ball Grid Array Packages
Lei Nie, Center for Advanced Life Cycle Engineering (CALCE) |
New Nanotechnology for Solderable Surface Finishes
Andy Lesko, Ph.D., Nils Arendt, and Wessling Bernhard, Ph.D., Ormecon International GmbH |
DDIs FLAT-WRAPT — Solution to Copper Wrap Plate Problems
Rajwant Sidhu, Ph.D. DDi Corp |
Industry-Academic Partnership Model for Leveraging New Trends in Microelectronics Assembly
Robert Luke, Ph.D, George Brown College |
Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
Pranav Desai, Intel Corporation |
Advanced Glass Reinforcement Technology for Improved Signal Integrity
Patricia Goldman and John Kuhn, Dielectric Solutions, LLC; and Russell Dudek, Compunetics, Inc. |
Various LCP Based Circuit Constructions and Fabrication Techniques
John Coonrod and Andy Slade, Rogers Corporation |
Nano Technology for Advanced PCB Surface Finishes
Andy Lesko, Ph.D., Nils Arendt, Dipl.-Ing., Wessling Bernhard, Ph.D., Ormecon International GmbH |
The “Product Audit” – A Strategy for Eco-Compliance
Jim Cronin,
EMT
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