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Educational Free Forums and Posters
Tuesday-Thursday, April 6-8
Free Forums give you even more reasons to attend! Join industry experts and peers as they discuss challenges and cutting-edge solutions in these free interactive sessions.
Industry poster sessions showcase research findings.
FF01 Test & Inspection Summit
Tuesday, April 6, 1:30 pm–3:00 pm
Moderator: Rick Nelson, Editor-in-Chief, Test and Measurement World
Panelists:
- Heiko Ehrenberg, Managing Director U.S. Operations, GOEPEL Electronics LLC
- Chad Hankinson, President, Fixture and Services Group, Everett Charles Technologies
- David Levine, National Sales Manager, Seica Inc.
- Jack Rozwat, General Manager, EMT Americas, Agilent Technologies
- Frank Silva, Vice President, FocalSpot, Inc.
The emergence of 3-D chips is posing test challenges to board and system designers as well as chip makers. Designers and manufacturers will have to pay particular attention to design-for-test techniques, leveraging the DFT that chip makers provide to support PCB test, field diagnostics, and field firmware upgrades. Building on the 2009 Summit, a panel of experts will discuss the latest test challenges and the technologies that are emerging to deal with them, including JTAG/boundary-scan test and vectorless test techniques as well as the continued role of in-circuit electrical test, optical inspection, X-ray inspection and functional electrical test.
FF02 Military Roadmap
Tuesday, April 6, 3:15 pm–4:45 pm
Moderator: Steve Lach, Vice President, North America Operating & Global Engineering, Merix Corporation
Panelists:
- George Dudnikov, Senior Vice President & Chief Technology Officer, Sanmina-SCI
- Raj Kumar, Vice President & Chief Technology Officer, DDi Corp.
- Al Wasserzug, Director of Corporate Development, Vulcan Flex Circuit Corporation
Charged with the development and implementation of a PCB and interconnect technology roadmap for the Department of Defense (DoD), the DoD Executive Agent (EA) is required to create a policy to ensure that the DoD has access to PCB manufacturing capabilities and the technical expertise necessary to meet future military requirements.
To assist the EA, leading North American printed board manufacturers on the IPC Executive Agent Task Force created a roadmap to identify the challenges printed board designs and materials will need to overcome to meet future DoD and OEM needs. This forum will cover the various sections of the roadmap and how the roadmap will:
- Match technology capability with product performance requirements, and
- Sustain and build upon a North American printed board industry capable of supporting DoD needs and ensuring national security.
FF03 Changing Environment of Printed Circuit Board Technology and the Evolution of Safety
Wednesday, April 7, 1:30 pm–3:00 pm
Moderator: Crystal Vanderpan, Principal Engineer - P.C. Technologies, Underwriters Laboratories Inc.
UL has been in the forefront in research in many product areas and has recently been very active in the area of printed boards. Learn the details of UL’s recent and ongoing PCB research, including possible changes in test methods, requirements and standards, in order to accommodate the quickly changing board and material technologies. Hear how your company can use UL labs and technical experts to collaborate on new research.
FF04 Don’t Be Surprised by the New RoHS
Thursday, April 8, 10:30 am–12:00 pm
Moderator: Fern Abrams, Government Relations and Environmental Policy, IPC
Panelists:
- Michael Battaion, Corporate Director, Environmental Leadership, Flextronics International
- Krista Botsford, Founder/Principal, Botsford EcoTech Partners, LLC
- Michael Hutchings, Program Manager - Substance PMO, Sun Microsystems Inc.
- John Sharp, Corporate Product Compliance Manager, TriQuint Semiconductor, Inc.
The Eu RoHS Directive had an enormous impact on the electronics industry and, now, the European Union is at it again. Our panel of experts will discuss proposed changes to the RoHS Directive that are currently being debated in Europe, including a new and broader scope of covered electronics, additional substance restrictions and a new compliance program under the CE mark.
FF05 IPC Technology Roadmap
Wednesday, April 7, 3:15 pm–4:45 pm
Panelists:
- Dieter Bergman, Director, Technical Transfer, IPC
- Jack Fisher,Interconnect Technology Analysis, Inc. Qi Qiao Jie
- Michael Weinhold, Technical Director, EIPC
Wouldn’t it be nice to have a yellow brick road to follow to business success? Unfortunately, nothing in business is that simple. Companies spend considerable time understanding the needs and wants of their customers and trying to figure out the direction technology is moving. But is their data comprehensive? And what about opportunities to enter new markets or extend beyond a current customer base? The IPC Technology Roadmap provides fabricators, EMS companies, designers, and materials and equipment suppliers with a consolidated view of today’s solutions and tomorrow’s needs for the printed board and assembly supply chain. This seminar will provide attendees with an understanding of the critical information contained in the roadmap and explain how it can be used to develop business and market strategies, and to validate and justify capital investment or to guide development activities. Panelists will also discuss the use of the roadmap in Europe and the automotive industry, as well as detail the new automated emulator tools provided with the roadmap to help in analyzing future product technical drivers.
Learn how the IPC Technology Roadmap can become a part of building your own yellow brick road!
FF06 Solar Panels: New Opportunities for Electronics
Wednesday, April 7, 10:30 am–12:00 pm
Moderator: Dongkai Shangguan, Ph.D., Vice President - Advanced Technology, Flextronics Corporate Technology Group
Panelists:
- Dr. Alan Rae, Managing Member, TPF Enterprises LLC
- Dr. Ryne P. Raffaelle, Director, National Renewable Energy Lab
- Bettina Weiss, Sr. Director, Photovoltaic Segment, SEMI International
Green is hot! And it looks like there’s nothing greener than solar. What opportunity does this offer for you? How will electronics support the “green wave” to solar power? Join us for this forum on technology and opportunity!
Technical Posters
Posters will be available for viewing beginning on Tuesday, April 6.
Authors will make poster presentations on Wednesday, April 7, 3:30 pm-4:30 pm.
Poster |
Title |
Author |
Company |
P01 |
Printable Materials and Devices for Electronic Packaging | Rabindra Das, Ph.D. | Endicott Interconnect Technologies, Inc |
P02 |
High Density Substrate Solution for Complex Fine-Pitch Flip Chip Applications | Vern Solberg | Solberg Technical Consulting |
P03 |
Robust Void Detection and Measurement | Bonnie Bennett | Intel Corporation |
P04 |
Effect of Squeegee Blade on Solder Paste Print Quality | Rita Mohanty | Speedline Technologies, Inc. |
P05 |
Determining Dielectric Properties of High Frequency PCB Laminate Materials | John Coonrod | Rogers Corporation |
P06 |
Design Guidelines for Stencil Design Using Regression Equation to Improve Yield After Reflow Machine in Printed Circuit Assembly (PCA) Process. | Subrat Prajapati | Larsen & Toubro Ltd |
P07 |
An Example of a Universal, Low-pin Count Automated Test Equipment for Printed Circuit Assemblies | Heiko Ehrenberg | Goepel Electronics LLC |
P08 |
Sculpted Flex Circuits Provide Interconnect Solutions | Al Wasserzug | Vulcan Flex Circuit Corporation |
P09 |
Solder Joint Reliability from Material Properties | Christopher Hunt | National Physical Laboratory |
P10 |
RoHS/REACH Compliance Challenges for RF-IC Packages | Bora Mumtaz | Peregrine Semiconductor |
P11 |
Simplifying Conversion and Enhancing Outgoing Product Quality on the ICOS Vision System with TRIZ | Darin Moreira | Intel Microelectronics |
P12 |
Initial Corrosion Study of Soldered Interconnects Utilizing No-Clean Flux | Roger Berg | Medtronic Inc. |
P13 |
A Novel Low Loss Material for High Frequency PCB Application | Juho Shin | Doosan Electro-Materials Co. Ltd. |
P14 |
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages Under Torsion Loads | Michael Osterman | University of Maryland |
P15 |
A Novel Technology of Packaging Substrate and Application Thereof | Chih Kuang Yang | Princo Corp |
P16 |
EA Activated Hydrogen Fluxless Soldering: A Promising Solution to Advanced Packaging and 3D Interconnection | C. Christine Dong | Air Products and Chemicals |
P17 |
An Optimized N2 Inerting Technology for Wave Soldering | C. Christine Dong | Air Products and Chemicals |
P18 |
Corrosion Impacts from Free Air Cooling | Randy Schueller, Ph.D. | DfR Solutions |
P19 |
Design of Diplexer Using in Wi-Fi System with Embedded Passive Technology | Yung-Chung Chang | Industrial Technology Research Institute |
P20 |
Cryogrinding Method for Laminate Formulation Development | Anteneh Worku | The Dow Chemical Company |
P21 |
Performance Comparison of Alloy/Flux Systems on an Automated Selective Soldering Machine | Edward Cherizola | Cookson Electronics / Alpha Metals |
P22 |
Detecting Faulty ICs in Depot Repair | David Sigillo | Seica Inc. |
P23 |
New Techniques Challenge Traditional Stencil Manufacturing Beliefs | Richard Lieske | DEK International |
P24 |
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards | David Lee | Johns Hopkins University |
P25 |
Influence of Conductor Surface for High Frequency PCB on Electrical Properties and Reliability | Mutsuyuki Kawaguchi | MEC Company Ltd. |