Supporters
Sponsored by:
- China Printed Circuit Association
- European Institute of Printed Circuits
- Hong Kong Printed Circuit Association
- International Electronics Manufacturing Initiative (iNEMI)
- Indian Printed Circuits Association
- International Microelectronics And Packaging Society (IMAPS)
- Japan Electronics Packaging and Circuits Association (JPCA)
- Japan Robotics Association (JARA)
- JEDEC Solid State Technology Association
- Korea Printed Circuit Association (KPCA)
- Microelectronics Packaging and Test Engineering Council (MEPTEC)
- Surface Mount and Circuit Board Association (SMCBA)
- Taiwan Printed Circuit Association
In Cooperation with:
- Adhesives and Sealants Industry (ASI) Magazine
- Advanced Packaging
- ASSEMBLY
- Chip Scale Review
- Circuit Cellar
- Circuitnet
- CircuiTree
- Circuits Assembly
- Connector Specifier
- Dempa Publications, Inc.
- EE Evaluation Engineering
- EMChina.org.cn
- EMS Now
- EMT Worldwide
- EPP Europe
- Equipment Protection
- Global SMT & Packaging
- iConnect007
- Materials Engineering News
- MDeviceNow.com
- Medical Products Outsourcing
- Metal Finishing
- Printed Circuit Design & Fab
- Printed Circuit Journal
- Reed Business Information Asia
- SMT Magazine
- SMTNet
- Test & Measurement World
- THERMAL News
- U.S. Tech
- Wiring Harness News
APEX Trade Show Subcommittee
- Jason Spera, Aegis Industrial Software Corporation
- Mike Konrad, Aqueous Technologies
- Leo van de Vall, Assembléon America
- Alec J. Babiarz, Asymtek
- Tom Nash, BTU International
- Karen Moore-Watts, DEK International GmbH
- Sebastian Schmidt, ERSA Inc.
- Scott E. Wischoffer, Fuji America Corporation
- Marc Peo, Heller Industries
- Douglas Dixon, Henkel Corporation
- Brian Duffey, MYDATA Automation, Inc.
- John Macrina, Panasonic Factory Solutions Company of America
- Brad Bennett, Universal Instruments Corporation
IPC Printed Circuits Expo Tradeshow Subcommittee
Chairman: Fred Johnson, Schmid Systems Inc.
- Rick Lies, Chemcut Corporation
- Art Wolfrum, MacDermid, Inc.
- David Vaughan, Taiyo America, Inc
Technical Program Committee
Conference Director: Greg Munie, Ph.D., Kester
- Jasbir Bath, Flextronics International
- Michael Beauchesne, Amphenol Printed Circuits, Inc.
- Beverley Christian, Ph.D., Research in Motion Limited
- Dennis Fritz, MacDermid, Inc.
- Happy Holden, Mentor Graphics Corporation
- David H. Hoover, Multek
- R. Wayne Johnson, Ph.D., Auburn University
- Russell H. Nowland, Lucent Technologies
Exhibitor Sponsors
- Conference Bags – PACE Inc.
- Badge Lanyards – Sony Manufacturing Systems America, Inc.
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