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Anselm, Martin
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Martin Anselm is the manager of Failure Analysis Services for the Universal Instruments Corporation's Advanced Process Lab. Over the years, Anselm has worked with some of the worlds largest electronics manufacturers on projects involving process development; material selection; root cause failure analysis in medical, military, and consumer electronics; and HDI circuit board construction. He holds a Master of Science in mechanical engineering from Clarkson University and an undergraduate degree in physics from SUNY Geneseo. Currently working on his Ph.D. in materials engineering at Binghamton University, Anselm’s research topic involves Cu-Ni-Sn intermetallic formation kinetics on Ni substrates.
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Carano, Michael
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Michael Carano is vice president of technical operations for OMG Electronic Chemicals, Inc.
He holds 29 patents covering a variety of technologies including plating, metallization processes and PCB fabrication techniques. Carano has published and presented numerous articles in the areas of copper plating, tin plating, PCB technologies and analytical control of electroplating baths. He serves on the IPC Board of Directors.
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Cherian, Gabe
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Gabe Cherian holds more than 30 patents, and has 40 years of industry experience. Specializing in development of new products, manufacturing processes and machines, Cherian has worked at AMP and Raychem, in addition to serving as an instructor of engineering at University of California – Berkeley and York College in Pennsylvania.
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Febo, Mike
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Jim Vanden Hogen has over 25 years of experience in the design, purchase, manufacture, assembly, test and sales of printed circuit boards. Vanden Hogen has performed technical and quality audits of more than 30 PCB fabricators, both domestic and offshore. He co-authored the original Plexus PCB DFM guidelines.
Mike Febo has 29 years of experience in the electronics industry, and is currently developing engineering solutions for the medical and networking sectors. Prior to joining Plexus, Mr. Febo was a member of the technical staff at Bell Laboratories.
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Ferrari, Gary
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Gary Ferrari has more than 35 years of experience in electronic packaging, with an emphasis on board design and manufacturing. He has held senior operations, quality and engineering positions in both OEM and supplier environments, written numerous technical articles and provided DFM consulting services to the industry. He has chaired a number of IPC design committees, including the committee responsible for the widely used IPC-2221/2222 design standards. Ferrari co-founded the IPC Designers Council and helped develop the Designers Certification program. He was honored with the IPC President’s Award in 1990.
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Finstad, Mark
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Mark Finstad is the applications engineering manager at Minco, and has 27 years of experience designing and manufacturing flex and rigid flex circuits. He is a regular speaker on flex circuit design at IPC and PCB events. Finstad co-chairs the IPC D-11 Flexible Circuits Design Subcommittee (IPC-2223), and is an active member of the IPC D-12 Flexible Circuits Performance Subcommittee (IPC-6013) as well as several flex circuit materials and test methods committees. Finstad co-authors a regular column "Ask the Flexperts" in Circuitree magazine with Mark Verbrugge. He has also published many feature articles on sound flexible circuit design practices in industry trade magazines.
Mark Verbrugge is an applications engineer in the Flex Circuit division of Minco Products in Fridley Minnesota. He has 28 years experience in the PCB industry, the last 22 building and designing flex and rigid-flex circuits. Verbrugge is an IPC certified interconnect designer and co-authors a monthly trade publication column on flex circuit design and manufacture.
Mark Verbrugge is an applications engineer in the Flex Circuit division of Minco Products in Fridley Minnesota. He has 28 years experience in the PCB industry, the last 22 building and designing flex and rigid-flex circuits. Verbrugge is an IPC certified interconnect designer and co-authors a monthly trade publication column on flex circuit design and manufacture.
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Foster, Dan
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Teresa Rowe is the director of Quality for the Logistics and Technical Services business unit of AAI, an operating unit of Textron Systems, a Textron Inc. company. She is the chairman of the IPC 5-22A J-STD-001, 5-22BT J-STD-001 Training, and 7-34T Repair Training Technical (IPC-7711/7721) Task Groups as well as the 5-22 Soldering Subcommittee. Rowe is a certified IPC trainer (CIT) for J-STD-001, IPC-A-610, IPC-A-620 and IPC-7711/7721.
Dan Foster is a senior analyst with Defense Acquisition Incorporated, supporting the Quality Department for the Missile Defense Agency. He has more than 25 years experience in electronics manufacturing training and rework. Foster is the vice chair of both the IPC 5-22A J-STD-001 Task Group and the 7-34T Repair Training Technical Task Group (IPC-7711/7721). He was a Master Instructor in IPC standards 610, 620, 001, 7711/7721. Foster currently is a CIT in all of these standards.
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Hall, W. James
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Phil Zarrow and Jim Hall have been actively involved in electronic assembly technology for more than 25 years. They have been involved with set-up and troubleshooting through-hole and SMT processes all over the world, working with OEMs and EMS companies to solve assembly problems and optimize facility operations. Phil Zarrow has chaired and instructed numerous technical seminars. One of the pioneers of reflow technology, Jim Hall is a certified Six Sigma black belt.
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Hartley, Richard
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Rick Hartley is a senior principal engineer at L-3 Communications – Avionics Systems. He also teaches and consults with major corporations worldwide to prevent and resolve noise, signal integrity and EMI problems. His focus is on circuits and PC boards for aircraft avionics, computers and telecommunications, with an emphasis on control of noise, in both digital and RF circuits.
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Klenke, Bob
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Bob Klenke is a consultant to the printed circuit board assembly industry, working with EMS companies and OEMs to solve assembly problems and optimize facility operations. His career spans over 25 years of work at Siemens, Plexus and Philips.
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Lasky, Ronald
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Ronald C. Lasky, Ph.D., PE is an instructional professor and a Six Sigma master black belt Instructor at Thayer School of Engineering, Dartmouth College. Dr. Lasky serves as director of the Cook Engineering Design Center, and as a senior technologist at Indium Corporation of America. He has more than 30 years of experience in electronic and optoelectronic packaging, including work at IBM, Universal Instruments and Cookson. The author of five books, Dr. Lasky holds a doctorate in materials science.
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Lee, Dale
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Dale Lee is a staff DFX process engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields. He has more than twenty years experience in various technical and managerial positions. Lee has served as an author, instructor and presenter on many topics, including advanced SMT packaging, PCB and SMT design, assembly, DFX and rework, and he is a past recipient of the SMTA’s “Excellence in Leadership” award. Lee has been very involved with multiple industry associations, including SMTA and IPC.
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Lee, Ning-Cheng
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Dr. Lee has more than 20 years of experience in the development of fluxes and solder pastes for SMT. His background also includes a focus on the development of high temperature polymers, encapsulants for microelectronics and adhesives.
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Luthra, Mukul
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Mukul Luthra is an electrical engineer with more than 35 years of experience in the electronics industry, with an emphasis on SMT. He has been involved with high-volume manufacturing, quality and process engineering in the hard disk drive, PCBA and semiconductor fields. Luthra has served as a director at Seagate Technology and ST Microelectronics, and has published more than 40 technical papers, features and columns.
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Mead, States
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States Mead has completed operational consulting assignments for many top-tier EMS and OEM companies as a member of the Panasonic Factory Solutions of America team. Prior to joining Panasonic, he worked at Tyco Electronics as an industrial engineer, project manager and business unit manager in the United States, China and Brazil. He recently received his Society of Manufacturing Engineers (SME) Lean Silver Certification.
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Mier, Norman
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Norman Mier, Jr. has over 20 years of experience in electronics rework and repair. He is a US Marine Corps veteran, trained through the US Navy Micro Miniature (2M) Repair Program. Mier is certified as a Master Instructor in IPC A-610D, J-STD-001D, IPC A-620 and 7711/7721. Currently with BEST, he provides training to technicians and engineers in advanced surface mount technology and process improvement; he also creates customized courses tailored to equipment.
Bob Wettermann is an electrical engineer with extensive experience in marketing, sales and design. He holds several patents in surface science and factory automation products.
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Mohanty, Rita
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Dr. Mohanty is a certified Six Sigma instructor with more than 15 years of experience in both industry and academia relating to engineering and electronic polymers, electronic packaging and assembly. Prior to joining Speedline, Dr. Mohanty managed the R&D group at Cookson Semiconductor materials group. She received her B.S., M.S. and Ph.D. in chemical engineering from the University of Rhode Island.
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Prasad, Ray
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Prior to starting his consulting practice providing SMT solutions, Ray Prasad held key technology positions at Boeing and Intel. At Intel, he was responsible for developing and implementing SMT. Prasad has published a text book, chaired the committee that drafted IPC-7095 and received the IPC Presidents Award. He received his B.S. in metallurgical engineering from the Regional Institute of Technology, Jamshedpur, India, and his M.S. in materials science and engineering and his M.B.A. from U.C. – Berkeley.
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Ramkumar, S. Manian
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Dr. Ramkumar teaches courses in SMT electronics packaging and manufacturing automation. He was instrumental in developing the CIM and Surface Mount Electronics Manufacturing Laboratory and curriculum at RIT, and has been the principal investigator for several applied research projects.
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Ritchey, Lee
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Lee Ritchey has participated in the design of more than 3,000 high-speed PCBs, ranging from PC mother boards and elevator controllers to the backplanes used in terabit routers. The author of two books on high-speed design disciplines, he consults for top manufacturers of Internet and server products, and is currently involved in the design of super-computer class products, video games and servers. His background includes program management for 3Com and the Apollo space program.
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Rowe, Teresa
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Teresa Rowe is the director of Quality for the Logistics and Technical Services business unit of AAI, an operating unit of Textron Systems, a Textron Inc. company. She is the chairman of the IPC 5-22A J-STD-001, 5-22BT J-STD-001 Training, and 7-34T Repair Training Technical (IPC-7711/7721) Task Groups as well as the 5-22 Soldering Subcommittee. Rowe is a certified IPC trainer (CIT) for J-STD-001, IPC-A-610, IPC-A-620 and IPC-7711/7721.
Dan Foster is a senior analyst with Defense Acquisition Incorporated, supporting the Quality Department for the Missile Defense Agency. He has more than 25 years experience in electronics manufacturing training and rework. Foster is the vice chair of both the IPC 5-22A J-STD-001 Task Group and the 7-34T Repair Training Technical Task Group (IPC-7711/7721). He was a Master Instructor in IPC standards 610, 620, 001, 7711/7721. Foster currently is a CIT in all of these standards.
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Schmieder, Don
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Jim Vanden Hogen has more than 30 years of experience in the design, purchase, manufacture, assembly, test and sales of printed circuit boards. Vanden Hogen has performed technical and quality audits of more than 30 PCB fabricators, both domestic and offshore. He co-authored the original Plexus PCB DFM guidelines.
Don Schmieder has more than 17 years of experience in purchasing, procurement, manufacturing, assembly and testing of PCBs, and has performed technical and quality audits of numerous PCB fabricators. Schmeider helped develop Plexus’ PCB fabrication specification and IST qualification process.
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Shea, Chrys
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Chrys Shea’s industry experience includes R&D applications engineering for Cookson, and surface mount process engineering for several major OEMs. She has published numerous papers on stencil printing, process control and reflow and wave soldering. She holds a B.S. in mechanical engineering and an M.S. in manufacturing engineering.
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Smith, Daniel
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Dan Smith has been involved in all aspects of the PCB design process for over 30 years, using a variety of EDA tools to design PCBs, flex, thick film and ICs. He is the author of several U.S. software patents that have reduced design process bottlenecks, and has worked at Motorola, U.S. Robotics and Shure. Smith is the co-writer of training materials, industry articles and company and IPC standards. He is active in IPC and a member of IEEE.
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Solberg, Vern
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Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has more than 25 years of experience related to both commercial and aerospace electronic products, and is active as an author and educator. Solberg holds several patents for IC packaging innovations, including the folded-flex 3D package technology, and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology.
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Vanden Hogen, Jim
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Jim Vanden Hogen has more than 30 years of experience in the design, purchase, manufacture, assembly, test and sales of printed circuit boards. Vanden Hogen has performed technical and quality audits of more than 30 PCB fabricators, both domestic and offshore. He co-authored the original Plexus PCB DFM guidelines.
Don Schmieder has more than 17 years of experience in purchasing, procurement, manufacturing, assembly and testing of PCBs, and has performed technical and quality audits of numerous PCB fabricators. Schmeider helped develop Plexus’ PCB fabrication specification and IST qualification process.
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Verbrugge, Mark
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Mark Finstad is the applications engineering manager at Minco, and has 27 years of experience designing and manufacturing flex and rigid flex circuits. He is a regular speaker on flex circuit design at IPC and PCB events. Finstad co-chairs the IPC D-11 Flexible Circuits Design Subcommittee (IPC-2223), and is an active member of the IPC D-12 Flexible Circuits Performance Subcommittee (IPC-6013) as well as several flex circuit materials and test methods committees. Finstad co-authors a regular column "Ask the Flexperts" in Circuitree magazine with Mark Verbrugge. He has also published many feature articles on sound flexible circuit design practices in industry trade magazines.
Mark Verbrugge is an applications engineer in the Flex Circuit division of Minco Products in Fridley Minnesota. He has 28 years experience in the PCB industry, the last 22 building and designing flex and rigid-flex circuits. Verbrugge is an IPC certified interconnect designer and co-authors a monthly trade publication column on flex circuit design and manufacture.
Mark Verbrugge is an applications engineer in the Flex Circuit division of Minco Products in Fridley Minnesota. He has 28 years experience in the PCB industry, the last 22 building and designing flex and rigid-flex circuits. Verbrugge is an IPC certified interconnect designer and co-authors a monthly trade publication column on flex circuit design and manufacture.
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Webb, Susy
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Susy Webb is a senior PCB designer with 29 years of design experience in a variety of fields, including work with point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. Webb has set up standards, procedures, shortcuts and library conventions for departmental use. She is a CID (certified interconnect designer) and serves on the IPC Designers Council Executive Board and Education Committee.
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Wettermann, Robert
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Norman Mier, Jr. has over 20 years of experience in electronics rework and repair. He is a US Marine Corps veteran, trained through the US Navy Micro Miniature (2M) Repair Program. Mier is certified as a Master Instructor in IPC A-610D, J-STD-001D, IPC A-620 and 7711/7721. Currently with BEST, he provides training to technicians and engineers in advanced surface mount technology and process improvement; he also creates customized courses tailored to equipment.
Bob Wettermann is an electrical engineer with extensive experience in marketing, sales and design. He holds several patents in surface science and factory automation products.
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Williams, Steven
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Steven Williams is a 32-year veteran of the electronics industry, currently responsible for Plexus’ strategic materials management and tactical support of the custom engineered components supply base. He is the author of Survival Is Not Mandatory: 10 Things Every CEO Should Know About Lean and columns for CircuiTree and PCB007.
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Willis, Bob
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Bob Willis is technical director of the SMART Group. He is a specialist in implementing SMT and has been involved in the introduction and implementation of lead-free process technology. He has traveled worldwide lecturing on electronics assembly.
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Zarrow, Phil
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Phil Zarrow and Jim Hall have been actively involved in electronic assembly technology for more than 25 years. They have been involved with set-up and troubleshooting through-hole and SMT processes all over the world, working with OEMs and EMS companies to solve assembly problems and optimize facility operations. Phil Zarrow has chaired and instructed numerous technical seminars. One of the pioneers of reflow technology, Jim Hall is a certified Six Sigma black belt.
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